Mobile phone heat sink semiconductor back clip patch cooling physical cooling device aluminum alloy adhesive thermal conductivity soaking plate


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Item ID:   LS688608116-03-01
Supplier SKU:   cp006-4061-3
Available Platform:   aliexpress amazon ebay lazada shopee wayfair wish
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Unit Price:   $4.50        
  • Product Description
Product Size Length: 1.00cm Width: 1.00cm Height: 1.00cm Product Weight 0.020kg
Packing Size Length: 1.00cm Width: 1.00cm Height: 1.00cm Packing Weight 0.020kg

Mobile phone heat sink semiconductor back clip patch cooling physical cooling device aluminum alloy adhesive thermal conductivity soaking plate

Mobile phone heat sink semiconductor back clip patch cooling physical cooling device aluminum alloy adhesive thermal conductivity soaking plate

Packing list Mobile phone heat sink semiconductor back clip patch cooling physical cooling device aluminum alloy adhesive thermal conductivity soaking plate